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| Datasheet File OCR Text: |
| ZMD-Standard August 2003 Package SSOP20 (3,9 mm) Dimensions in millimetres Based on JEDEC JEP95: MO-137 1 Dimensions View X X MDS 767 k x 45 bp 0,15 M A2 0,1 A A1 20 11 Z 1 e D 10 Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,4 g Low Stress Epoxy Cu-Alloy solder plating Z-bends 1,73 0,20 0,30 0,635 5,84 6,20 0,41 1,5 HE E Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* kmin min max 1,54 0,10 0,25 1,40 1,55 0,18 0,25 8,55 8,73 3,82 4,00 0,25 0 10 * without mold-flash Zentrum Mikroelektronik Dresden Editor: signed Schoder Check: signed Marx Date: 08.08.2003 Quality: signed Tina Kochan Doc-No. QS-000767-HD-01 c LP |
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